Exhibit packages for Medical MEMS 2018 are available. For further information and questions about exhibiting, please click here.


Allwin21 Corp. was formed in 2000 with a focus on professionally providing production-proven rapid thermal process, plasma asher strip / Descum, plasma etch/RIE, sputter deposition, and metal film metrology semiconductor equipment, services and technical support in the semiconductor III-V, MEMS, biomedical, nanotechnology, solar, & LED industries. We endeavor to be a leader in our product lines. To achieve this, we have been providing unique innovative and cost-effective technical solutions, high quality equipment, and on time spare parts delivery worldwide. We have maintained a global presence that has grown and expanded into the major high-tech manufacturing areas of the world. We pride ourselves on developing and continuing lasting customer relationships. We understand that a timely, responsive support and service are critical elements in semiconductor industries. Allwin21’s experienced engineer team is the best guarantee for high quality service and support. Allwin21 Corp. is the exclusive licensed manufacturer of AG Associates Heatpulse 610 Rapid Thermal Processing.


Coat-X provides unique solutions for protecting high value-added components against moisture penetration and corrosion. Our ultra-thin biocompatible multilayer coating technology is able to protect the most critical parts of your products, should they need to function in harsh environmental conditions. Our low temperature proprietary batch process has been applied successfully to different type of sensors, microsystems, PC boards, magnets, watch components and medical devices. The solutions offered by Coat-X meet requirements in compliance with the highest international quality standards for hermeticity; corrosion resistance and/or biocompatibility. Coat-X’s novel technology can replace conventional and expensive, metal, glass or polymer encapsulation/protection solutions and can be used for many different applications.


Covalent Metrology is a one-stop-shop for measurement and characterization services and expertise. We offer in-house measurement and imaging of advanced materials, coatings and devices as well as a single point of contact to access a wide network of specialized service labs and instrument makers around the world. Covalent partners with customers, leveraging our metrology expertise, network and infrastructure to solve development challenges, improve products and increase yields. Our customers work in many industries including semiconductor manufacturing, photonics, and energy storage, generation and conservation (e.g., batteries, PV, glass or thermal coatings).


GDSI is the first true, bona fide service company in the USA to offer non-contact dicing using the Stealth Laser approach. Dicing represents one of numerous physical challenges with producing MEMS and sensor devices on a commercial scale. Stealth creates an internal scribe or modification layer in the material, eliminating the need to protect your device layer. Same day service is possible. 25+ years of experience supporting both NPI and production programs in the Silicon Valley. Special emphasis on custom thinning, dicing, automated pick and inspection of fragile parts with protection of the device in mind. ISO 9001:2015 registered with a robust quality management system. Offering consultation on mask layout so your MEMS wafer can accommodate Stealth Laser dicing. GDSI collaborates with several large IC foundries and MEMS manufacturing groups, focusing on yield improvement and design for manufacturability for your device.


GPD Global designs and manufactures precision liquid dispensing systems for a variety of applications in different markets. In conjunction with our applications lab, we offer complete solutions for fluid deposition in consumer electronics, microelectronics, MEMS sensors, semiconductor packaging, medical device, automotive, aerospace, defense and other industries. With cutting edge pumps and platforms, solutions have been developed for dispensing micro-volume solderpaste, conductive epoxies, COB encapsulation, underfills, UV cure materials with onboard spot curing and wafer level solutions.

IMT is the premier independent MEMS technology and production services provider in United States. Since its start in 2000, IMT continues to offer the most complete turnkey services from design through high-volume production. As an acknowledged leader in complex MEMS, we offer our experience in a diversity of applications that include RF and DC switching; mirrors, microlenses, and optical benches for communications; drug discovery/delivery; biomedical implants and cell purifiers; microfluidics; valves and pumps; accelerometers; gyros; magnetic sensors; particle sensors; and gas and pressure sensors, among others. IMT’s comprehensive front-end wafer processing includes sub-micron photolithography, hermetic wafer-level packaging, isolated metal-filled through-silicon vias, wafer thinning/CMP, and extensive non-CMOS materials flexibility, complemented by unmatched metrology, FA, and testing capabilities. Speak with an IMT representative to see how we can make your MEMS work for you.

Integrated Surface Technologies (IST) designs and manufactures surface modification systems for the MEMS and biotech industries. Organic and inorganic molecular films can be deposited in your lab or factory by using IST’s sub-atmospheric, low temperature vapor and plasma enabled deposition equipment. IST can fulfill every level of surface engineering requirements for the industry. From bench top systems for R&D and pilot production, to full size manufacturing systems, IST supplies the equipment, the chemistry and engineering services. Typical applications include: anti-stiction monolayers, adhesion promoters, release layers, hydrophilic-to-super-hydrophobic coatings, atomic layer deposition (ALD) of metal-oxides, and many other customer specific films. Our engineers can help you to select the best chemistry for each specific application. The correct chemistry is then delivered in cartridges for easy change over in the systems, to keep production running and for R&D flexibility.

KST World Corp. services as a wafer foundry providing various services, especially super thick oxide film up to 12 inch size over 25um, with patented technology for over 20 years. Using thick oxide film technology, we provide unique thick BOX SOI wafer not only normal SOI wafer or cavity SOI wafer. Today, KST World’s unique and advanced technologies meet and drive customer’s technological requirements in worldwide market.

LioniX International is a leading global provider of customized microsystem solutions in scalable production volumes. We provide customized solutions for OEM’s and system integrators, from design to fully assembled modules, via vertical integration and in scalable production volumes. We maintain our technology leadership secured by a strong IP position. LioniX International develops customized MEMS solutions and produces them in small to medium volumes. We offer flexibility in design as well as in process. We are prepared to leave the standard processing routes and develop customized process variations and combinations to achieve manufacturable solutions meeting your specification requirements. Our customer base consists of OEM’s, system integrators and startups looking for a MEMS solution. Our MEMS activities are driven by state of the art technology and as such our customers are within the MEMS hot areas, such as bioMEMS, microfluidics, physical and chemical Sensors, and optofluidics. Our chips drive your business.

Lyncée Tec is the world pioneer and leader of patented Digital Holographic Microscope (DHM®) technology, based in Lausanne, Switzerland. It offers matured DHM® based holographic microscopes for 4D (time-sequence of 3D) profilometry with unrivalled non-scanning acquisition speed, sub-nanometer resolution and in-situ process characterization for both in-plane and out of plane at the same time. Applications include MEMS analyzer, high-throughput semiconductor inspection, microfluid, liquid crystal and bio living cell etc. For MEMS dynamic characterization, DHM combined with stroboscopic unit enables full-field 3D measurements without any XYZ scanning, including frequency scan, in-plane and out of plane vibrations, impulse response detection. Advanced data processing software provide 3D dynamic video, 3D tracking on large in-plane motion device, and device vibration maps for full-field motion amplitude and phase distribution. Samples could be in vacuum, environment chamber of temperature control, or liquid immersion. Fast and economic data collection rate present DHM as a powerful in-line inspection tool for MEMS manufacturing and qualification."

MEMS Foundry offers standard and customized bipolar and bicmos wafer foundry processes on 100mm and 150mm wafers. MEMS Foundry has the experience and expertise to develop custom semiconductor process flows around a MEMS smart sensor, resonator or optical device starting from a pure R & D concept to volume production. Located in the heart of Silicon Valley, MEMS Foundry is ideal for customers who need to develop a full custom MEMS product requiring a unique process flow. MEMS Foundry offers Process Integration of many types of sensors requiring nonstandard process flows otherwise unavailable from high volume wafer fabrication entities. MEMS smart sensors are used in avionics, automotive, communications, computing, defense, medical, military, optoelectronics, telecommunications, space and wireless applications. Smart MEMS are built in USA which is an added benefit to customers with proprietary IP. Customers with special process needs and small volume runs are welcome. MEMS Foundry is a self-sufficient, vertically integrated wafer fabrication based in Silicon Valley. MEMS Foundry has recently upgraded its toolset capabilities with a 5X stepper capable of processing 250 micron to 700-micron thick wafers, two Ion implanters and several dry etchers. MEMS Foundry customers have the option for monolithic integration with BIPOLAR, BICMOS or CMOS as well as package-level integration. Fabless customers can take advantage of the rare set of semiconductor manufacturing capabilities at MEMS Foundry to develop and manufacture of a wide range of MEMS smart sensor products.

Micralyne is a leading independent MEMS foundry, and volume manufacturer of novel MEMS devices with over 30 years of MEMS development and manufacturing expertise. Micralyne’s fabrication solutions have been used in MEMS sensors for precise measurement devices, MEMS optical switching technology, lab-on-a-chip components, micro-needles, pressure sensors, gas sensors, accelerometers, thermal imaging sensors, and microfluidics. We are both ISO9001 and ISO13485 certified. Micralyne’s MEMS foundry model allows clients to access enhanced services such as validated MEMS technology processes and platforms, advanced packaging – WLP, TSV, TGV, discrete and custom sub-assembly services. This foundry model has successfully produced products for industries such as: bio-medical, aerospace, automotive, oil and gas, telecom, and industrial sensors. Micralyne offers our customers a strategic partnership with deep technical knowledge and fabrication capabilities coupled with an integrated quality and project management support. Connect with us today and leverage our experience to manufacture your MEMS devices.

We provide innovative lab-on-a-chip and MEMS solutions: solutions that will help our customers improve their products and research, contributing to the quality of life. Our unique combination of micro- and nanotechnologies, different materials, microfluidics and MEMS knowledge and customer application knowhow, enables us to provide our customers with the innovative and sustainable solution they are looking for. Micronit was founded in 1999, with its initial focus on the miniaturisation of devices using micro technology. After a few years our focus shifted to microfluidics for life sciences applications. Since then we have transformed from a parts supplier to a lab-on-a-chip and bioMEMS product development and manufacturing partner, providing our customers with total solutions.

OnScale is the world’s first Solver-as-a-Service platform – a combination of advanced computer-aided engineering (CAE) multi-physics solvers with a scalable Cloud high-performance computing (HPC) engine. OnScale breaks performance barriers for engineers by providing near-limitless Cloud HPC resources to solve today’s toughest engineering challenges. OnScale also breaks cost barriers for engineering teams of all sizes by providing world-class CAE multi-physics solvers and Cloud HPC on a subscription-based pay-as-you-go pricing model. With OnScale, engineers can run massive multi-million degree-of-freedom multi-physics simulations and vast numbers of simulations in parallel to optimize systems like ultrasonic transducer arrays for near-field 3D object classification for ADAS applications very quickly with minimal cost. Design studies that were once impossible with legacy CAE tools and on-premise HPC are now possible.

Oxford Instruments is a leading provider of high technology products and services to the world's leading companies and scientific research communities. Our businesses image, analyze and manipulate materials down to the atomic and molecular level, enabling our customers to accelerate their R&D, increase productivity and make new scientific discoveries.

When you need a custom MEMS device for your system, you can rely on our experts. Their expertise is to really understand your requirements, to show feasibility and proof of concept, develop the product and required process in a stage-gated manner and reproduce reliably and controlled.

As an innovation service provider, we want you to be successful in delivering innovations to the market, where they can matter to your customers and society as a whole. Our mission is simple: to accelerate the innovation of our customers, from start-up to multinational. Being globally active with more than 1,000 experts we can support innovation processes end-to-end, driving first-time-right designs and thus improving your time to market.


Polytec is a world leader in optical measurement systems with a wide variety of solutions for product development and research in micro- and nanotechnology applications. Whether you want to efficiently measure MEMS right on the wafer-level, test prototypes for process optimization, characterize cMUTs, pMUTs, SAWs and BAWs in real-time, validate models, conduct extensive and precise micromechanics analysis, test the reliability and service life of MEMS, or characterize MEMS in biology and medicine, we have a custom solution for you. Our newly released MSA-600 Micro System Analyzer enhances the quality and performance of static and dynamic characterization and visualization of MEMS devices and microstructures: validate FE models, detect the effects of cross-talk and the finest profile deviations early on. This optical measuring station offers non-contact surface characterization and vibration analysis in-plane and out-of-plane. In addition to the MSA-600, our MSA-100-3D system features 3D laser vibrometry for dynamic characterization of MEMS. The MSA-100-3D enables real-time measurement of tri-axial motion with picometer resolution and MHz bandwidth. Automated scan measurement capability provides 3D animations for visualization of complex deflection shapes. Our technology and custom solutions are widely used in the MEMS research community.

Semefab has an impressive track record of process development, process set-up and volume foundry supporting silicon-based MEMS, CMOS, ASIC, bipolar-linear & discrete semiconductor device technologies. Founded in 1986, Fab1 produces a diverse process portfolio of 4" CMOS, ASIC, bipolar-linear & discrete semiconductor technologies. Fab1 fabricates precision analog integrated circuits, JFET transistors, bipolar transistors, photo diodes, mixed signal ASICs and supports the 'front-end processing' for many different MEMS technologies. In 2009, Semefab invested £15.2M, creating Fab2, for processing of 6" and 4" MEMS technologies and Fab3 for 6" CMOS/bipolar technologies. Fab3 became operational in 2011. All 3 fabs have completely autonomous services and facilities.

Sensera Inc. is a designer and manufacturer of specialized high-performance sensors, and modules. Sensera’s core expertise in MEMS-based technologies, is bringing custom devices from concept to market. Sensera provides end-to-end solutions and services in the rapidly growing world of the Internet of Things (IoT). Our technical staff have extensive experience in material science, MEMS and semiconductor process development, prototyping and volume production. In our Boston based MEMS and microfabrication facility we operate class 100, 1,000 & 10,000 cleanrooms for wafer processing and fiber optic and electro-optical micro assembly. We have QMS driven process development and manufacturing and the flexibility to develop and bring in new technologies.

Silex Microsystems is the world’s largest pure-play MEMS foundry enabling the world’s most innovative companies to participate in the Sensors Everywhere revolution. MEMS development requires deep specialized knowledge and expertise as a new device goes from prototype to qualification to mass production. Silex is dedicated to bringing customers quickly, cost-effectively and reliably through the product development cycle with: expertise in rapid commercialization of MEMS products; innovation that delivers transformative MEMS manufacturing capabilities; responsive and collaborative partnering to enable customers’ success from MEMS project inception to production; proven, stable and high-volume MEMS manufacturing capacity.

Sono-Tek Corporation provides precision ultrasonic coating systems for the semiconductor industry depositing uniform, repeatable thin film photoresist or polyimide layers onto various surface profile substrates. With control of thickness from submicron to above 100 microns and the ability to coat any shape or size, Sono-Tek’s coating systems are an excellent alternative to other coating techniques like spin and traditional spray. Common applications for photoresist and polyimide coatings include but are not limited to MEMS, lenses, microfluidic devices, microelectronics, and filters. Sono-Tek’s coating systems are able to coat both flat and 3D substrates such as silicon wafers, glass, ceramic, and metal. Sono-Tek has been providing ultrasonic coating solutions to companies around the globe since 1975. Visit our website or email info@sono-tek.com for more information.

SÜSS MicroTec Group is a leading supplier of equipment and process solutions for microstructuring applications with more than sixty years of engineering experience. Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components. Product and solutions include: photomask equipment, coater and developer, mask aligner, projection scanner, laser processing systems, wafer bonder, micro-optics and remanufactured equipment.

Tronics is an international full-service MEMS manufacturer with wafer fabs in Europe and the USA, offering one of the broadest portfolios of MEMS processes in the industry. Fast prototype turnaround, high volume manufacturing, comprehensive test and packaging capabilities – Tronics delivers MEMS, from tested wafers to integrated custom components. Tronics engineering support includes electronic interface development, assembly and custom packaging. Tronics is "much more than a MEMS foundry" in the sense that it offers the full service spectrum required for successful transformation of OEM concepts into reliable MEMS products, such as accelerometers, gyros, pressure sensors, switches, mirrors, or bioMEMS.

UBOTIC Company Limited provides advanced MEMS & sensor package integration from prototype to production with a focus on low cost open-tool and custom cavity packaging as well as custom housing & lids. We provide lead-frame and substrate design along with fabrication of molded air cavity QFN packages (AQFN), LGA, SOIC cavity, custom lids, molded housing and SIP. Specializing in custom design and materials to meet today’s product environments from harsh automotive and medical to industrial and consumer. Additional services include both thermal and electrical modeling along with package qualification and reliability testing. The factory is certified in TS16949:2009 and ISO9001-2008.

ULVAC Technologies, Inc. (ULVAC) was established in 1992 as the US subsidiary of ULVAC, Inc. Headquartered in Methuen, Massachusetts, ULVAC provides a broad portfolio of manufacturing equipment for the vacuum, materials and thin film industries. ULVAC's solutions diversely incorporate equipment, materials, analysis, and services for flat panel displays, electronic components, semiconductors, MEMS and general-industry equipment. In addition, the Methuen facility is equipped with a class-10 cleanroom for process development, customer demonstration and manufacturing of the ENVIRO solvent-free dry photo resist stripper and compound semiconductor materials etch systems. Other in-house services include foundry etch (for deep oxide and compound semiconductor materials), thermal processing, materials characterization, and vacuum pump/leak detector repair. ULVAC supports a variety of MEMS production technologies, for applications ranging from micro sensors to flow channel modules, optical switches, and bio-MEMS.

WACKER is among the world’s leading and most research intensive chemical companies and is a worldwide innovation partner to customers in many key global sectors. Products range from silicones for automotive, transportation, aerospace and many other diverse industries; binders and polymer additives to bioengineered pharmaceutical actives and hyperpure silicon for semiconductor and solar applications. With around 16,900 employees, WACKER generated sales of €5.29 billion (2015). Headquartered in Munich, Germany, WACKER globally has 25 production sites, 21 technical competence centers and 48 sales offices. WACKER is represented regionally in North America by WACKER Chemical Corporation in Adrian, MI. As a technology leader focusing on sustainability and a Responsible Care® member, WACKER promotes products and ideas that offer high value-added potential to ensure a better quality of life based on energy efficiency and protection of the climate and environment. WACKER is certified to ISO 9001 and RC 14001.

Founded in 1998, Yole Développement (Yole) has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and image sensors, Compound Semiconductors, RF Electronics, Solid-state lighting, Displays, software, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management. The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, PISEO and KnowMade, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business.

Exhibit Opportunities

To ensure a more exclusive and intimate networking environment for both the exhibitors and the attendees, the exhibits will only be open to conference attendees. The exhibit package is only $2,495 and includes the following:

  • One (1) conference and reception admission
  • Printed conference program and presentation slides in electronic format
  • One (1) 6-foot table, draped
  • Two (2) chairs
  • Custom 11”x17” tabletop sign with company logo and description
  • Company logo and description in the printed conference program and on printed conference signage
  • Company logo and description on event website
  • Company logo and description on event dedicated emails to subscribers of MEMS Journal and our media partners; event promotions will reach 70,000 to 80,000 individuals in the medical, biotech, MEMS, sensors and semiconductor industry segments.

Upgrade to the Deluxe Exhibitor option which enables you to give a 10-minute talk to the entire audience during the Technology Showcase. It's a great way to draw more attention to your company. Deluxe Exhibitor and Technology Showcase spots are limited – click here to register today!

For further information about exhibiting, please contact Jessica Ingram at jessica@memsjournal.com or call 360-929-0114.

Exhibit space is limited. Sign up today!

Past Exhibitors

Many thanks to our exhibitors from the 2013-2017 events.

acam provides intelligent ASIC solutions for MEMS sensors. The versatile solutions can be used with a variety of sensors (e.g. capacitive or resistive) and are well suited for portable medical devices thanks to the very low current consumption. The high resolution and measurement rate of the chips make them perfect for the use in high-end applications. The on-board processing capability in form of a microprocessor allows for compact sensor fusion, e.g. to make the linearization of a pressure sensor directly on chip.

acam is a privately owned company with its headquarter located in the south of Germany. A worldwide distributor network assures local support with offices in North America, Europe and Asia.

Advance Reproductions is a leading supplier of high-quality, large-area and optical photomasks and phototools. Advance is an ISO 9001and ITAR registered company. We support manufacturers throughout the world involved in the manufacturing of semiconductor, hybrid, microwave, nanotechnology, medical and electronic packaging devices. Advance Reproductions provides solutions and custom manufacturing services for research and development, custom shaped substrates and engineered tooling.

Allion is a leader in flexible and innovative product testing and validation. We have the expertise and infrastructure to tackle a wide range of technologies. Our real-world testing environments allow our clients to see how their product performs in the places their customers use it most. For other challenges, Allion engineers combine their technical skills and creativity to develop new testing methods that fit your product. We use resources such as our partnership with Cinder Solutions to build the necessary tools for all kinds of product validation. No matter what stage of the development process you are in, we’re ready to help.

ALLVIA provides silicon/glass interposer and through-silicon via (TSV) foundry services for semiconductor, optoelectronics and MEMS industries, meeting the demands of advanced vertical interconnects. With 2.5D, 3D and System-in-Package (SiP) solutions. ALLVIA, a leader in TSV development, provides design & processing for frontside (filled) and backside (conformal plated) through-silicon vias and offers services for prototyping as well as volume production runs.

Alpha Precision specializes in custom ultrasonic machining of wafers and high precision surface polishing for excellent anodic bonding for MEMS. The ultrasonic process results in high precision placement and tolerances of features on the MEMS wafer. Ultrasonic machining does not impart any substrate cracking, stress or temperature change. This process is applicable to many different brittle substrates such as glass and ceramic. End use features include through vias, cavities and grooves. ISO/TS 16949:2009 Certified Quality Process.

Alpha Precision also does specialty MicroBlast machining of many different shapes and sizes.

Alston & Bird LLP has grown to become a national AmLaw 50 firm while remaining steeped in a culture with client service and teamwork as the cornerstones of all that we do. We develop, assemble and nurture the strongest and broadest array of legal talent and expertise necessary to meet our clients’ needs in an ever-changing and fast-paced environment.

Alston & Bird’s unique culture and core values have been nurtured for more than a century. They define who we are and how we interact with our clients and with each other. From the founding of the firm in the late 1800s, collegiality, teamwork, loyalty, diversity, individual satisfaction, fairness and professional development have been guiding principles and values by which we measure ourselves.

Microelectronics assembly technologies including: advanced packaging and SMT assembly on PCB, PCB-FLEX and ceramic substrates. We support high complexity and small miniature assemblies from prototype to production. Our Silicon Valley facility includes 2,500 square feet cleanroom ISO 7 with on-site process development, engineering and manufacturing support. Advanced packaging: We support precision die attach and flip chip with DATACON 2200 EVO Plus; wire bond (Au ball, Au wedge, Al wedge) with KNS ICONN and H&K BJ820 and BJ815; and encapsulation with Glob Top, dam & fill and UV materials with ASYMTEK S820 with dispense jet and auger pumps. SMT assembly: Lead-free with 01005, BTC, QFN, WLCSP, uBGA and 0.4mm pitch IC and connectors; PCB from 0.012” to 0.200”; PCB-FLEX from 0.004” to 0.010”; and ceramic 0.010” to 0.040” thickness.

Analog Devices is a leader in creating technologies that bridge the physical and digital worlds across a wide range of industrial automation, instrumentation, communications, automotive, healthcare, and numerous other industries. Our precision sensing MEMS technologies are designed to deliver the highest level of performance, accuracy, and robustness for complex and demanding applications where data integrity, reliability, and power efficiency are critical. Analog Devices technology and design solutions are helping shape the future of healthcare diagnostics, clinical monitoring equipment, life science & medical instrumentation, and health and wellness device designs. Our comprehensive portfolio of linear, mixed signal, MEMS sensors and digital processing technologies set industry standards and are backed by leading design tools, applications support, and systems expertise. We take a true systems approach to functional integration and collaborate with our customers to create differentiation in the marketplace.

Boschman Technologies is the world leading supplier of automatic molding systems that use film for the encapsulation of Sensor and MEMS devices. This process, called Film Assisted Molding is ideal for applications where sensing surfaces or bond pads or heat sinks must be exposed and free of mold compound bleed and flash. This technology is used for MEMS, Sensor, Solar, and Optical molding applications with the transfer molding of epoxy or silicone based mold compounds, including clear materials. In addition, Boschman serves as a one-stop shop for research, development, qualification, prototyping and small volume manufacturing services by focusing on MEMS, Sensors, and advanced IC and wafer level packaging applications. By working closely with customer R&D departments to explore new packaging concepts, value from Innovation to Industrialization is provided.

Smart devices, harsh environment sensing, intraoperative cancer detection, foldable paper electronics, and wearable medical devices are some examples of sensor-based technology pioneered at the Berkeley Sensor & Actuator Center, a Graduated NSF Industry/University Cooperative Research Center for Micro/Nanoelectromechanical Sensors & Systems (MEMS/NEMS). Current research at BSAC will have an even greater impact on consumer, industrial, and medical products. Contact us for information on how to become involved with new and improved technology being developed at BSAC.

Cactus Semiconductor is a fabless semiconductor company producing low-power mixed signal application-specific integrated circuits (ASICs). Founded in 2002, the company has brought to market numerous system-level analog and mixed signal ASICs for low-power battery-operated electronics. These solutions include medical integrated circuits (IC) – or medical ASICs - including ASICs for Class III implantable and ingestible medical devices. Additionally, they include ICs for portable applications and power management devices where small size and low power are critical components. Cactus Semiconductor is ISO 9001:2008 qualified. The company maintains its headquarters in Chandler, AZ.

Canon’s Industrial Products Group offers manufacturing equipment (PVD, etching, lithography, vacuum components, etc.) for semiconductor and other industries. We have 50 years of experience in vacuum technology and related equipment manufacturing. Our PVD product line includes oblique sputtering that enables precise film deposition with exceptional uniformity. These products can be adapted for a wide range of wafer sizes. Recently, we released following products: wafer bonding equipment and X-ray source for testing. Wafer bonding equipment employs a new technology that offers permanent bonding at room temperature and without application of high pressure. All kinds of wafers can be bonded using this technology. X-ray source for testing is a transmissive type microfocus source that is designed to enable high speed imaging. It offers high (4μL/S) resolution at 10W. It features self-diagnosis of X-ray tube life, is target maintenance-free, and warms up within 3 minutes.

Cicor Advanced Microelectronics ↦ Substrates (AMS) offers you a broad range of state-of-the-art products and services. In the area of microelectronics, we can offer you the latest technologies in packaging, assembly and interconnection techniques. In the field of substrate manufacturing and processing, we are characterized by the production of highly complex rigid, flexible and rigid-flexible printed circuit boards and substrates using thin and thick film technology.

CONNECTEC JAPAN specializes in the semiconductor assembly business, “OSRDA” (Outsourced Semiconductor Research, Development & Assembly). We have unique low-temperature and low-load damage-less FC bonding technology. We provide clients a one-stop solution including substrate design, structure proposal, process development, proto-typing, evaluation, analysis and mass-production.

Diamond MT was founded in 2001 as a firm specializing in contract applications of Conformal Coatings for Department of Defense and Commercial Electronic Systems. Since our beginning, Diamond MT has established a reputation for providing the highest quality services in the industry. Our commitment to quality, integrity and customer satisfaction combined with an unmatched expertise in applications and processes has provided every one of our customers with superior results.

Diamond MT offers a highly skilled workforce, rapid turn around manufacturing and high reliability through an established quality program, along with experience of commercial manufacturing requirements, competitive pricing and on-time delivery.

DISCO is the world leader in cutting, grinding, and polishing technology. With more than 40 years of experience in precision processing a wide variety of materials, DISCO has amassed a vast knowledge base in these core competencies. DISCO manufactures blade and laser saws as well as wafer thinning equipment along with dicing blades, grinding wheels, and polishing pads. In addition, DISCO offers a variety of services including process optimization, joint development initiatives, and consultative services. Next generation product prototyping and production services are available at the Development Center in Santa Clara, CA.

EAG Laboratories, a global scientific services company, has expertise in materials characterization and testing services for the biomedical device industry.  EAG scientists have the technical and regulatory know-how to help you accelerate product development, overcome R&D roadblocks, avoid regulatory setbacks and solve problematic manufacturing issues.

Excelitas Technologies is a global technology leader focused on delivering innovative, customized optoelectronics and advanced electronic systems to a global customer base of leading OEMs seeking high-performance, market-driven technologies.

Finetech's precision die bonders provide sub-micron placement accuracy and process modularity within one platform: thermo-compression/sonic, eutectic, epoxy, ACF & Indium bonding, sensitive materials (GaAs/GaP), UV curing. Ideal solutions for advanced technology applications: flip chip, laser bars & diodes, VCSELs, MEMs, sensors, detectors, 3D, W2W / C2W, photonics packaging, and micro-optics assembly.

The Greater Geneva Berne area is a Swiss economic development agency representing the interest of six Swiss cantons (states) in Western Switzerland: Berne, Fribourg, Geneva, Neuchatel, Valais and Vaud. Surrounded by France, Germany and Italy, our region offers a welcoming environment for companies to collaborate, develop and commercialize their technologies on an international scale. With our dense and sophisticated life science and microtechnology clusters representing nearly 5000 companies, more than 500 labs, and 120,000 workers, these sectors have converged to create an academic and commercial environment of international renown in the MEMS, sensors, and high-tech biomedical sectors.

Companies are drawn to our region because of the potential for synergies and close collaboration with our unique institutions such as the Swiss Federal Institute of Technology (EPFL) with 19 specialized labs in microtechnology, the Swiss Center for Electronics and Microtechnology (CSEM), the Swiss Foundation for Research in Microtechnology, our six cantonal universities, and our three University Hospitals of Berne, Geneva, and Lausanne.

Research is a top priority in Switzerland where more scientific publications and patents are filed per capita than anywhere else in the world. Our region's above average spending on fundamental and applied research is the result of long-standing policies and initiatives to attract investment and collaboration in high value-added sectors.

We offer an accessible regulatory environment; an open clinical community; low taxes; an educated, multilingual, multicultural workforce; science parks and incubators; networking platforms; state-funded collaboration programs; and a world-class quality of life.

As a government sponsored association, our mission is to provide support and assistance to companies (MEMS, sensors, life sciences, etc.) interested in the benefits that Switzerland can bring to them. Our support ranges from facilitating relationships with potential partners to helping negotiate the regulatory environment to all aspects of establishing an enterprise in Switzerland. For more information, please contact Matt Julian at 512-301-3337 (office), 512-586-7035 (cell) or m.julian@ggba-switzerland.ch (email).

Founded in 1984, Heidelberg Instruments is today a global leader in design, development and manufacturing of complex laser based maskless lithography systems. These systems are critical to fabrication of advanced photomasks and direct write solutions in the areas of Advanced Electronic Packaging, Flat Panel Display, MEMS, Integrated Optics and other micro and nano based applications.

Heidelberg Instruments’ customers include many of the major global nano and micro technology based corporations along with some of the leading research and development organizations that provide components used in an array of electronic, communication and information technology products.

Heidelberg Instruments is located in Heidelberg, Germany, with global customer support offices in Asia, Europe, and North America. The company is 100% privately owned by the management and employees.

Located in the heart of Silicon Valley, Hionix specializes in delivering fast turnaround innovations in materials and thin films, to enable cutting edge products in semiconductors, consumer electronics, bio-medical, data storage, and sensor technologies. It is Hionix's mission to provide top-quality thin film deposition services promptly and at an economical price. Hionix offers aluminium to zirconium films are for substrates varying from 25mm to 450mm. For TSV, Hionix can provide barrier and seed with high step coverage for many patterned structures and can achieve 20% continual side wall coverage on via. Hionix offers in house wet and dry thermal oxidation services. Thicknesses vary from 500A to 1um on 25mm - 450mm diameter wafers. Hionix can supply 25mm to 450mm silicon or glass wafers.

Through its investment in fundamental technology research, IMRA has been a pioneer in the femtosecond fiber laser industry. The company has built an extensive intellectual property portfolio that serves as a foundation for its laser technology and products. Continued development of this technology has kept IMRA at the forefront of state-of-the-art ultrashort pulse laser systems. IMRA is devoted to both the development and manufacture of the world’s most reliable and robust femtosecond lasers, and to the advancement of scientific knowledge through original research. IMRA’s dedication to strict manufacturing standards ensures the production of lasers with unmatched reliability and durability.

IMT offers the most complete MEMS foundry services in our fully automated 30,000 sq ft, 6” wafer fab. IMT’s extensive product experience includes DC and RF switching, drug discovery/delivery, microfluidics, cell sorting, inertial navigation, optotelecom, IR emitters, and others. IMT offers wafer bonding for both hermetic packaging/encapsulation and microfluidics including: fusion bonding, anodic bonding, glass frit bonding, Au-Au thermocompression bonding, metal alloy bonding and various types of polymer bonds. IMT’s wafer-level packaging and through silicon via technologies are production proven for the next generation 3D packaging and interposer applications. IMT is ISO 9001 certified offering complete turn-key foundry services from design through high-volume production. We bring our customers’ MEMS to volume production. Speak with an IMT representative to see how we can make your MEMS work for you.

Infinite Graphics Incorporated (www.IGI.com) is redefining precision quality imaging by solving phototooling challenges where size, substrate and dimension are unique. Stop by our booth to discuss your projects requiring incomparable quality photomasks, photolithography, 3D sculptured microstructures and sophisticated software editing, just to name a few. Featured products: photomasks services, 3D micro-structures, MLAs, software solutions - CAD CAM, imaged glass products.

Invenios designs, develops, and manufactures microfluidics, MEMS, and 3D microstructures. The company also engineers exclusive processes and custom production equipment that is required to manufacture this range of products. Invenios has a fully capable microfluidics/MEMS foundry that offers high performance, cost effective solutions for both established and emerging companies. Unlike traditional microsystems foundries, Invenios delivers a complete production cycle, which includes design review, process development, manufacturing, and testing within an ISO 9001 environment to support a broad range of micron and sub-micron level products.

Kent State University is internationally recognized for its biomedical research. Current research strengths across the many disciplines at Kent State are particularly compatible with the bioengineering fields of tissue regeneration, biomaterials, biocompatibility, sensors and implanted devices. Our researchers are developing transdermal implants for amputees, improving neural function with implanted electrodes, creating implanted sensors for monitoring blood chemistry and vital signs and designing drug delivery devices that can be implanted or worn on the skin. Our researchers are also developing new medical sensors using advanced organic and polymeric materials to measure biomarkers and other biochemical indicators of disease, injury and trauma. Other materials research focuses on improving the biocompatibility of materials, decreasing the risk of infection from implanted devices, producing Lab-on-a-Chip devices for diagnostic and therapeutic applications and creating a new generation of flexible electronic medical devices for implantation and other applications. Kent State is also known for its research strengths in flexible electronics and liquid crystals within its Liquid Crystal Institute™(LCI).

The Lurie Nanofabrication Facility (LNF) at the University of Michigan offers 24/7 semiconductor processing capabilities on production-level equipment supported by professional staff. We have advanced processing capabilities for MEMS, BioMEMS, microfluidics and much more. We provide training and experience that will turn your ideas into reality. A full list of available equipment and capabilities are available online at http://lnf.umich.edu/index.php/capabilities.

Mager Scientific has provided sample preparation equipment and optical solutions to the fields of metallography, microscopy and electron microscopy since 1961. We are the authorized distributor of Leica Microsystems Nano Technology in the Midwest. This product line includes the EM CPD300 Critical Point Dryer.

Critical point drying is an important method used to clean, dry, and provide surface tension-free release of the delicate 3-D microstructures of MEMS devices. With the EM CPD300, Leica has fully automated the critical point drying process for Sol-Gels, Carbon Nanotubes, samples for SEM analysis, as well as for MEMS devices. Users of this instrument enjoy cost-saving efficiency via automation, reproducibility and ease of use.

Medical Main Street Network: a unique alliance of world-class hospitals, universities, and medical device and bio-pharma companies in Southeast Michigan. This concentration of top medical professionals creates a global center of innovation in health care, research and development, education, and commercialization in the life science industry. Oakland County is a major health care and life sciences powerhouse, employing more than 100,000 people—more than the Mayo and Cleveland Clinics combined. The region is a dynamic area to launch or expand a medical technology business, and Oakland County provides many resources to support a company’s success, including: Demographic data, Site location assistance, Financing options, Tax incentives, Introductions to state and local agencies, Workforce development, and Business consulting.

Medical Main Street - Maximizing the growth potential of the healthcare and life science sectors in Southeastern Michigan

At Medtronic, we're committed to Innovating for Life by pushing the boundaries of medical technology and changing the way the world treats chronic disease. To do that, we're thinking beyond products and beyond the status quo - to continually find more ways to help people live better, longer.

Micralyne is a leading independent MEMS and microfabrication foundry. We excel at creating process technology for complex MEMS devices and execute disciplined volume manufacturing. Micralyne extends its value to our customers by offering extensive packaging, testing, and design services, beyond a typical MEMS chip foundry. This Foundry Plus model has successfully produced products for industries such as: life sciences, aerospace, automotive, oil and gas, telecom, and industrial sensors. Micralyne offers our customers a strategic partnership with deep technical knowledge and fabrication capabilities. Our fabrication services fit their need by providing established process platforms and timely device fabrication through early prototype, qualification, and volume manufacturing.

MCL’s hermetic package sealing processes provide air leak rates E10 atm-cm3/sec, which is orders of magnitude lower than MIL-STD-883 Test Method 1014 for Aerospace Class K Devices. Developmental services include the complete hermetic package sealing process, including both headspace development and hermetic sealing with automated leak testing. Standard hermetic packages range from 1.2 x 1.6 mm surface mount chip carriers to larger more complex systems. For new product development or problem resolution, outsourcing your hermetic package sealing development will lower your cost of hermetic packaging.

MicroConnex fabricates a wide range of high-density, fine-pitch (1.1 mil trace/space), complex (multilayer with blind and buried vias) flexible circuits (FPC) and provides contract laser microvia-drilling and micromachining services. Using ESI 5330 and 5335 series laser systems along with IPG IX-6100s. The company machines various flexible and rigid materials, including alumina, kapton, and other exotic materials. MicroConnex also deposits (sputters) specialty thin-film materials.

Nanolab Technologies provides comprehensive cutting edge technology for failure analysis, analytical microscopy, surface analysis and FIB circuit edit, and has broad capabilities in reverse engineering and device circuit extraction. We specialize in fast turn-around and customized interaction with our customers. Servicing the semiconductor, MEMS, solar, nanotechnology, defense, advanced packaging and other high technology markets, we are ISO 9001 and ITAR certified and maintain highly secure protocol with all our customers. Nanolab Technologies is headquartered in Milpitas, CA with other facilities in Plano, TX and Albany, NY.

Neutronix-Quintel (NXQ) is a leading provider of high performance mask alignment systems since 1978. NXQ is comprised of a team of seasoned industry veterans with vast experience in photolithography, providing their customers with the most robust solutions which have been derived from many years of customer driven innovations. NXQ has well over 1000 systems installed around the world used for various technologies such as MEMS, compound semi, biomedical, microfluidics, HB LED, WLP, 3DIC / TSV, 2.5D interposer and HCPV. Prominent high volume manufacturing companies utilize NXQ’s equipment for end products such as transceiver chip sets for cell phones and other wireless devices, medical sensors, automobile sensors, LED lighting, military and defence electronics, IR detectors, optical devices used for communications and discrete devices. The company’s products are also used extensively throughout the world at universities and research institutes and are recognized as one of the most versatile and flexible mask aligners in the marketplace. NXQ works closely with customers to innovate and develop new features that differentiate their products from the competition. The company continues to gain market share with customers that require equipment suppliers who can meet their stringent needs for cost, performance and reliability. With the recently release of the 300mm platform, NXQ is well positioned to maintain double digit growth.

Nordson Corporation operates in more than 30 countries around the world delivering precision technology solutions to help customers succeed worldwide. The company engineers, manufactures and markets differentiated products and systems used for dispensing adhesives, coatings, sealants, biomaterials and other materials, fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing.

With over 100 years of experience, lessons learned, and know-how, Noritake is the leading industrial ceramics and materials company in all of Asia, United States and other points locally. This allows Noritake and its partners to share in development and innovation. New innovations include many kinds of printed circuit boards for automotive and medical sensors.

The National Nanotechnology Infrastructure Network (NNIN) is an integrated network of user facilities, supported by the National Science Foundation, serving the needs of nanoscale science, engineering and technology researchers across the country. The goal of the NNIN is to enable rapid advancement in science and engineering at the nanoscale by providing researchers with efficient access to nanotechnology infrastructure (fabrication, characterization and computational capabilities and facilities) and support from experienced staff members.

The Lurie Nanofabrication Facility (LNF) at the University of Michigan is one of the NNIN sites that offers 24/7 semiconductor processing capabilities on production-level equipment supported by a professional staff. With 1,160 m2 (12,500 ft2) of ISO class 4/5/6 and 7 (Class 10/100/1000 and 10,000) cleanrooms for processing pieces, 100 mm and 150 mm wafers, we have processing capabilities for silicon and organic devices, MEMs and bioMEMs, fluidics and biofluidics, and nanoimprint technologies.

With such an available suite of established technologies for a large range of applications, the LNF is ideal for rapid feasibility assessment of ideas and pilot/low-volume products. Whether you want to assess new process adjustments for your product without compromising your current process, explore new device directions, or simply take advantage of our advanced characterization capabilities, the LNF provides the complete cleanroom experience for your high tech needs. The LNF is also part of the National Nanotechnology Infrastructure Network (NNIN), an integrated network of user.

With over $20M in state-of-the-art equipment, we provide the training and experience that will turn your ideas into reality. A full list of available equipment and capabilities are available online at http://lnf.umich.edu/index.php/capabilities.

Novati Technologies

Novati Technologies is the leading innovation partner for accelerating nanotechnology development and commercialization. Novati's proven advanced technology and secure IP infrastructure combined with our Technology Development Process supports companies developing MEMS, microfluidics, novel transistors, photonics and other nanotechnologies for the semiconductor, healthcare & life sciences and aerospace & defense markets. Novati provides customers with technology building blocks, engineering expertise, professional program management and a broad complement of flexible processing equipment that enable the accelerated development of 200mm and 300mm silicon-based solutions. Looking forward, the company continues to integrate advanced 3D wafer stacking and TSV processes from its parent company, Tezzaron® Semiconductor, the world leader in 3D-ICs, as well as advanced wafer bonding processes from license partner, Ziptronix, Inc. All work is performed at Novati's state-of-the-art, DMEA-accredited trusted foundry, ITAR-certified wafer fab in Austin, TX.

Original Biomedical Implants, Inc. (OBI) was established in Texas with an initial focus of commercializing a new generation of dental drills and implants with a unique patented ultrananocrystalline diamond (UNCD) coating, which enables an order of magnitude superior performance over current products at competitive costs. After a return on investment (3 years), OBI will also commercialize high-revenue new generation medical devices such as MEMS drug delivery devices and biosensors, UNCD-coated prosthesis (e.g., hips, knees, stents), electrically conductive UNCD electrodes for neural stimulation, and much more. UNCD-based products will address the global health business which is projected to reach $365 billion per year in 2015 (Global Industry Analyst, February 2012).

When you need a custom MEMS device for your system, you can rely on our experts. Their expertise is to really understand your requirements, to show feasibility and proof of concept, develop the product and required process in a stage-gated manner and reproduce reliably and controlled.

As an innovation service provider, we want you to be successful in delivering innovations to the market, where they can matter to your customers and society as a whole. Our mission is simple: to accelerate the innovation of our customers, from start-up to multinational. Being globally active with more than 1,000 experts we can support innovation processes end-to-end, driving first-time-right designs and thus improving your time to market.

Picosun is a manufacturer of systems for the vacuum deposition of thin film materials by Atomic Layer Deposition (ALD). The ALD technique, by virtue of its controlled layer-by-layer atomic scale growth mechanism, can provide thin films that perfectly conform to nano-sized surface contours with precise control of film thickness and an exceptional degree of thickness uniformity. ALD has rapidly become a critical enabling technology for numerous application areas, and is currently poised to impact the MEMS and sensor markets. Picosun designs and builds ALD tools for both advanced R&D and pilot production, as well as for high volume manufacturing, and possesses a team of specialists and experts with experience dating from the inception of the ALD technique. Picosun has its main headquarters and factory in Espoo, Finland, regional offices in Detroit and Singapore, and and sales and service representatives in more than 20 countries worldwide.

Quantum Analytics is a value-added distributor, offering customized in-line production control and R&D metrology solutions. Financing options, technical services, including cross-platform system integration, installation, training and support come standard. We have partnered with a number of equipment manufactures to deliver contact-free, non-destructive, high-speed solutions to help keep pace with the growing demand for accurate process control. With platforms ranging from table-top to fully-automated systems, we offer flexible, configurable systems to address specific application needs. The digital holographic microscope (DHM®) allows direct full-field measurements of static and dynamic 3D topography at unrivaled speeds, without any vertical or lateral scanning. This unique acquisition mode makes the DHM® very robust against environmental production vibrations and noise. Its ability to observe and measure energized MEMS devices in real time makes it ideal for the investigation of dynamic processes.

Quik-Pak provides IC packaging and assembly services to the semiconductor, telecom, RF wireless, and medical markets. The company offers both custom open-molded plastic packages, and pre-molded plastic packages (OmPP.) Quik-Pak’s pre-molded plastic packages are cost-effective, come in a wide variety of sizes and lead counts, are available off the shelf, and are ideal for prototype or production volume applications. Quik-Pak also specializes in a variety of services that together provide a full turn-key packaging and assembly solution including wafer preparation, die/wire bonding, encapsulation and marking/branding - all under one roof. Custom assembly services are also offered for flip chip, ceramic packages, chip-on-board, stacked die, MEMS, etc.

At RBB Systems, we specialize in on-demand manufacturing of mission-critical electronic assemblies for the industrial, commercial, medical and military sectors. By embracing small batch custom assemblies of electronic circuit boards, we allow clients greater flexibility in meeting fluctuating market demands.

We combine the best lean manufacturing principles with a hungry can-do attitude. Our cost-effective, team-driven approach offers a meaningful alternative to offshore production. Our organizational mission is simple: We exist to move heaven and earth to get our small batch customers what they need, when they need it.

If you need low-volume printed circuit board assembly to support second-tier product lines or other small batch industrial electronics work, we invite you to contact us to learn more about our services, philosophies and capabilities.

Robson Technologies, Inc. (RTI), established in 1985, is a solutions based provider of customizable test sockets, test fixtures, automated curve tracing test equipment, and other high performance interfaces catered to the MEMS, semiconductor, medical, military, automotive, and other electronics test markets. RTI works with your team from prototype through production to produce a comprehensive and integrated hardware solution that bridges the gap between your device under test and your test or measurement system. RTI is an employee owned company located just south of Silicon Valley in Morgan Hill, California and all products are all built to order in-house via mechanical/PCB design, a high capacity machine shop, and product assembly/QA. Call on RTI to discuss your next test project and learn how you can benefit from a tailored test solution today!

Rogue Valley Microdevices is a full-service precision MEMS foundry that combines state-of-the-art process modules with the engineering expertise to go seamlessly from custom design to manufacturing. With commercially successful customers in microfluidics, lab-on-chip platforms and other biomedical devices, Rogue Valley Microdevices has the market-specific expertise to help bring your product to market — collaboratively, creatively and effectively. Beyond our MEMS fab, Rogue Valley also maintains the broadest and most comprehensive set of wafer services commercially available. Founded in 2003 and based in Medford, Oregon, Rogue Valley maintains a 200mm MEMS devices foundry. Visit us at Medical MEMS & Sensors 2016 to learn more about our design-to-manufacturing program for biomedical device companies. For more information, visit www.roguevalleymicro.com

Semefab is a volume foundry supporting an extensive process portfolio of MEMS, MOS, bipolar, opto-CMOS, ASIC and discrete technologies and supplies silicon wafers, die and packaged devices to the market. Semefab operates its own 6-inch and 4-inch volume foundries with complete autonomy between its MEMS and MOS/bipolar fabs.

Semefab also supports wafer and package test in its facilities. Supporting a commercialization business model, Semefab optimizes device structures and process flows within an ISO accredited environment and seamlessly transfers these into its volume foundries. As a global foundry, Semefab exports more than 74% of its fabricated product and ships more than 200 million die per year.

Sensirion is the leading manufacturer of high-quality sensors and sensor solutions for the measurement and control of humidity, and of gas and liquid flows. Millions of Sensirion's sensor components and solutions are used all over the world, including in the automotive industry, medical technology, building technology, industrial processes, and in consumer goods. Sensirion's success is based on the innovative CMOSens® technology, which combines the sensor and analysis electronics in a single semiconductor chip. Sites all around the world and a seamless distribution network mean we can be local to any customer anywhere in the world in order to provide the best possible support at every stage of the project.

Shin-Etsu Chemical, utilizing strengths from multiple divisions, offers an extensive product line of frontend materials, traditional packaging materials, advanced packaging materials and assembly materials. Shin-Etsu has the leading position for many materials utilized to manufacture and assemble sensors. Our products include resists, adhesion promoters, thermal interface material, molding compounds, encapsulants, silicone and epoxy coatings along with die attachment material.

Silex Microsystems is the world’s largest pure-play MEMS foundry enabling the world’s most innovative companies to participate in the sensory system revolution and commercialize MEMS technologies that are transforming the world. MEMS development requires deep specialized knowledge and expertise as a new device goes from prototype to qualification to mass production. Silex is dedicated to bring customers quickly, cost-effectively and reliably through the product development lifecycle with: expertise in rapid commercialization of MEMS products, pioneering innovation that delivers transformative MEMS manufacturing capabilities, responsive collaborative partnering driven to enable customers’ success, from project inception to volume production and proven, stable, high-volume MEMS manufacturing capacity

Silicon Microstructures, Inc. (SMI) is a premier developer and manufacturer of MEMS-based pressure sensors for a range of markets, with years of experience and expertise in low-pressure and harsh environment products that meet today’s stringent requirements for medical, automotive and industrial safety. SMI's design, production and quality control processes have enabled it to develop both the lowest pressure and smallest pressure sensors available on the market today.

Since 1986, Sonix has pioneered many of the breakthroughs in image accuracy and process productivity that have helped wafer and chip manufacturers literally transform the world. Where others have failed, we have consistently found the right answers to very difficult problems. Today, Sonix acoustic scanning microscopes are used by leading manufacturers worldwide to perform nondestructive inspection of bonded wafers and packaged semiconductors, from the development lab to the production floor. These industry-leading systems deliver the high-resolution images and advanced diagnostic tools that semiconductor designers and fabricators need to verify reliability, qualify new designs, monitor production, pinpoint device failures and improve process control. Technology innovation and leadership are at our core. We make substantial R&D investments, discovering what the future will require and developing novel solutions to meet evolving market demands. We collaborate with our customers to address today’s needs and tomorrow’s innovations as a team. Clearer diagnostic imaging, greater analytic control, faster throughput and more responsive service and support—that’s the Sonix difference.

Since 1974, Sonoscan, the leader in acoustic microscopy (AM), has manufactured systems in the USA and regional support laboratories in Asia, Europe and the USA for AM services. Sonoscan’s proprietary C-SAM® technologies have set the standard for over 40 years. Sonoscan provides non-destructive analysis for process control and quality assurance to safeguard your MEMS products as it accurately detects defects and process variations. Sonoscan offers instruments for the laboratory and automated test systems for front, mid and back-end microelectronics, including the AW series for various wafer configurations and the FACTS2™ DF2400™ for scanning MEMS devices in trays. Collaboration with Sonoscan customers and industries has led to many innovations, patents and standards over the years. Specific to the MEMS industry, transducers were developed and built by Sonoscan for bonded wafers, hermetic/cap seal, lab-on-chip and MEMS packaging inspection, plus automated accept/reject methods for die and cavity seal mapping of a wafer.

TECNISCO is a process service provider of precision components. We support design and manufacturing with our “cross-edge” microprocessing technology. In particular, our processing is used in the following fields: structured glass wafers for MEMS packaging; glass microfluidics for drug discovery and chemical reaction; customized heatsinks for laser diodes and LEDs. We can provide the 4 following advantages by undertaking several processes as a one-stop solution partner: 1. maintaining the stability of product quality, 2. shortening the lead time, 3. providing better cost-performance products and services and 4. solving customers’ problems by crossing our technologies and developing original products. About “cross-edge” microprocessing: TECNISCO’s original technologies provide the products which meet customers’ needs best from the viewpoint of quality, cost and productivity with combined technologies, crossing five processing technologies such as: cutting, grinding, polishing, metalizing, and bonding.

Tronics is an international full-service MEMS manufacturer with wafer fabs in Europe and the USA, offering one of the broadest portfolios of MEMS processes in the industry. Fast prototype turnaround, high volume manufacturing, comprehensive test and packaging capabilities – Tronics delivers MEMS, from tested wafers to integrated custom components. Tronics engineering support includes electronic interface development, assembly and custom packaging. Tronics is "much more than a MEMS foundry" in the sense that it offers the full service spectrum required for successful transformation of OEM concepts into reliable MEMS products, such as accelerometers, gyros, pressure sensors, switches, mirrors, or bioMEMS.

Tousimis manufactures highly reliable Supercritical CO2 Dryers. Our Critical Point Dryer (CPD) process technology eliminates surface tension forces enabling delicate 3-D micro structure preservation.

Current CPD applications include Biological, MEMS, Bio-MEMS, Aero Gel, Nano Particle, Carbon Nanotube, Graphene and others.

Tousimis also manufactures high purity fixatives and X-Ray Reference standards.

Tousimis is a USA based company supported via a global sales and service network.

Tystar is a service and solutions oriented equipment supplier to the semiconductor, MEMS and nanotechnology industries, offering a full range of diffusion, oxidation, LPCVD furnace systems as well as customer-specific specialty equipment. Tystar provides full equipment, process and application support. With over 1600 tubes operational around the world, Tystar maintains a global presence. Our products are accepted throughout the industry for their small foot print, high quality, reliability, efficiency and value. Additionally, Tystar has earned the reputation of offering outstanding customer service and support.

UBOTIC Company Limited provides advanced MEMS/sensor and specialty semiconductor prototype to production assembly with a focus on low cost open-tool and custom package design and fabrication. We provide package, lead-frame and substrate design along with fabrication of molded air cavity QFN package (AQFN), LGA cavity, over-molded QFN, SOIC cavity, stacked-die, ceramic, and custom SIP. Additional services include both thermal and electrical modeling along with package qualification and reliability testing. The factory is certified in TS16949:2009 and ISO9001-2008.


ULVAC Technologies, Inc. (ULVAC) was established in 1992 as the US subsidiary of ULVAC, Inc. Headquartered in Methuen, Massachusetts, ULVAC provides a broad portfolio of manufacturing equipment for the vacuum, materials and thin film industries. ULVAC's solutions diversely incorporate equipment, materials, analysis, and services for flat panel displays, electronic components, semiconductors, MEMS and general-industry equipment. In addition, the Methuen facility is equipped with a class-10 cleanroom for process development, customer demonstration and manufacturing of the ENVIRO solvent-free dry photo resist stripper and compound semiconductor materials etch systems. Other in-house services include foundry etch (for deep oxide and compound semiconductor materials), thermal processing, materials characterization, and vacuum pump/leak detector repair. ULVAC supports a variety of MEMS production technologies, for applications ranging from micro sensors to flow channel modules, optical switches, and bio-MEMS.

Biomedical Engineering at The University of Akron is both patient-centered as well as student-focused. We seek to find solutions to pressing needs of the medical community, and we expect our students to be at the forefront of medical innovation. Within our department, we focus on three areas of specialization: Biomechanics, Biomaterials & Tissue Engineering, and Instrumentation, Signals & Imaging. Through these areas we strive to (i) better understand mechanisms of disease, (ii) develop improved technologies for diagnosing or treating diseases, and (iii) educate the next generation of biomedical engineers. Knowledge gained through this approach fuels the rapid expansion of our region’s biomedical sector.

The University of Louisville's Micro/Nano Technology Center (MNTC) is a recognized Small Times magazine top 10 multi-user core facility open for business to external businesses and academic institutions. The MNTC consists of a state-of-the-art class 100/1000 10,000 ft2 cleanroom facility, a 900 ft2 core lab for device packaging/testing and a 300 ft2 software lab dedicated to MEMS (microelectromechanical systems), microelectronic and optical device modeling/simulation. This $30M facility has over 100 available tools and gives students and researchers the capabilities to design, model, fabricate and test. We invite you to use our facility to help further your research.

Valtronic innovates and manufactures miniaturized electronic products for trusted medical device partners. Valtronic’s customers are leading global suppliers of medical implants and devices, diagnostic imaging equipment and sensitive aerospace and industrial assemblies. For over 30 years, Valtronic has helped thousands of companies develop and produce Class II & III medical devices and advanced miniaturized electronic assemblies from their worldwide facilities from Switzerland, the USA and Morocco.

X-FAB is the world’s largest analog/mixed-signal foundry group manufacturing devices on silicon wafers for mixed-signal integrated circuits (ICs), CMOS sensors and MEMS. X-FAB operates from five manufacturing locations in the USA, Germany and Malaysia offering wafer capacity of over 850,000 200mm-equivalent wafers per year. X-FAB maintains compliance to ISO standards for automotive and medical foundry manufacturing and all operations are ISO/TS 16949 certified. The largest specialty fab group, X-FAB is unlike typical foundry services because of its expertise in combining advanced analog and mixed-signal CMOS process technologies with MEMS, specialized materials and wafer-level bonding and packaging. CMOS processes include options for non-volatile memory, high-voltage and high temperature. MEMS and sensors technologies include pressure sensors, inertial sensors, microphones, gas sensors, CMOS image sensors and ambient light sensors.

Meeting the stringent demands of companies worldwide, Yield Engineering Systems, Inc. (YES) manufactures processing equipment with cost-effective solutions for wafer-level packaging/redistribution layers, bioMEMS, semiconductor industries and more. YES manufactures high temperature vacuum cure ovens, polyimide cure ovens, silane vapor phase deposition systems, plasma etch and clean tools and vacuum bake/vapor prime ovens; Our proven applications include silane substrate adhesion for microarrays, biocompatibility, stiction reduction, wafer dehydration and surface tension modification. Designing and building products that increase yields, extend performance, and improve processes; all equipment is engineered, manufactured and tested in Livermore, California USA. The answer is YES to quality, flexibility, superior products and service.